Data Sheet

ADP5075

Rev. B | Page 19 of 19

OUTLINE DIMENSIONS

BOTTOM VIEW

(BALL SIDE UP)

A

B

C

D

0.660

0.600

0.540

1.65

1.61

1.57

2.22

2.18

2.14

1

2

3

0.360

0.320

0.280

0.50

BSC

BALL A1

IDENTIFIER

SEATING

PLANE

0.270

0.240

0.210

0.390

0.360

0.330

COPLANARITY

0.04

TOP VIEW

(BALL SIDE DOWN)

END VIEW

0.325

0.305

0.285

0.360

0.340

0.320

Figure 29. 12-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-12-11)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADP5075ACBZ-R7

−40°Cto+125°C

12-Ball Wafer Level Chip Scale Package [WLCSP]

CB-12-11

ADP5075CB-EVALZ

Evaluation Board

1

Z = RoHS Compliant Part.

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D12819-0-9/17(B)