HMC8413 datasheet(4/21 Pages) AD

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HMC8413

Data Sheet

Rev. 0 | Page 4 of 21

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VDD

7 V

RFIN Power

25 dBm

Continuous Power Dissipation (PDISS), TA = 85°C

(Derate 13.9 mW/°C Above 85°C)

1.25 W

Temperature

Storage Range

−65°C to +150°C

Operating Range

−40°C to +85°C

Peak Reflow (Moisture Sensitivity Level 1

(MSL1))

260°C

Junction to Maintain 1,000,000 Hours Mean

Time to Failure (MTTF)

175°C

Nominal Junction (TA = 85°C, VDD = 5 V,

IDQ = 95 mA)

119.2°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to

PCB thermal design is required.

θJC is the junction to case thermal resistance.

Table 4. Thermal Resistance

Package Type

θJC

Unit

CP-6-12

°C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of

ESD-sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for HMC8413

Table 5. HMC8413, 6-Lead LFCSP

ESD Model

Withstand Threshold (V)

Class

HBM

±500

ESD CAUTION

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