MIC5501 datasheet(5/22 Pages) MICROCHIP

部品番号	MIC5501

部品情報	300 mA Single Output LDO in Small Packages

PDF	22 Pages

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メーカー	MICROCHIP [Microchip Technology]

ホームページ	http://www.microchip.com

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TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Symbol

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Storage Temperature Range

–65

—

+150

°C

—

Maximum Junction Temperature Range

–40

—

+150

°C

—

Operating Junction Temperature Range

–40

—

+125

°C

—

Lead Temperature

—

+260

°C

Soldering, 10s

Package Thermal Resistances

Thermal Resistance 1 mm x 1 mm Thin DFN-4

JA

—

250

—

°C/W

—

Thermal Resistance SOT23-5

JA

—

253

—

°C/W

—

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

 2019 Microchip Technology Inc.

DS20006006B-page 5

MIC5501/2/3/4

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