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BAS40W データシート(PDF) 7 Page - FutureWafer Tech Co.,Ltd |
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BAS40W データシート(HTML) 7 Page - FutureWafer Tech Co.,Ltd |
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7 / 10 page ![]() BAS40 Series Surface Mount Switching Diode 7 Document No.: F21837S 27-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 6-1. Taping and Reel Specification 6-2. Embossed Carrier Tape Specification 6. Packing Dimension W D D1 E F P P0 P2 t W Value 8 mm 1.5 ±0.1 1.3 Max. 1.75 ±0.1 3.5 ±0.05 4 ±0.1 4 ±0.1 2 ±0.1 0.4 Max. 8 ±0.3 A0 / B0 / K0 Determined by Component Size. The Clearance Between The Component And The Cavity Must Comply to The Rotational and Lateral Movement Requirement Provided in Figures in The “Maximum Component Movement in Tape Pocket” Section. Unit: mm Taping Width Tape Orientation 8mm Direction Of Feed |
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