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ADP7112ACBZ-1.2-R7 データシート(PDF) 19 Page - Analog Devices |
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ADP7112ACBZ-1.2-R7 データシート(HTML) 19 Page - Analog Devices |
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19 / 21 page ![]() Data Sheet ADP7112 Rev. D | Page 19 of 21 PCB LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP7112. However, as listed in Table 6, a point of diminishing returns is eventually reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. Place the input capacitor as close as possible to the VIN and GND pins. Place the output capacitor as close as possible to the VOUT and GND pins. Use of 0805 or 1206 size capacitors and resistors achieves the smallest possible footprint solution on boards where area is limited. Figure 53. Example WLCSP PCB Layout |
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