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ADP7142ARDZ-2.5-R7 データシート(PDF) 6 Page - Analog Devices

部品番号 ADP7142ARDZ-2.5-R7
部品情報  40 V, 200 mA, Low Noise, CMOS LDO Linear Regulator
PDF  23 Pages
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
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ADP7142ARDZ-2.5-R7 データシート(HTML) 6 Page - Analog Devices

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ADP7142
Data Sheet
Rev. H | Page 6 of 23
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
3
GND
1
VOUT
2
SENSE/ADJ
4EN
6VIN
5SS
ADP7142
TOP VIEW
(Not to Scale)
EXPOSED PAD
NOTES
1. THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE
ENHANCES THERMAL PERFORMANCE AND IS
ELECTRICALLY CONNECTED TO GND INSIDE THE
PACKAGE. IT IS RECOMMENDED THAT THE EXPOSED
PAD CONNECT TO THE GROUND PLANE ON THE BOARD.
Figure 3. 6-Lead LFCSP Pin Configuration
ADP7142
TOP VIEW
(Not to Scale)
1
VIN
2
GND
3
EN
5
VOUT
4
SENSE/ADJ
Figure 4. 5-Lead TSOT Pin Configuration
ADP7142
TOP VIEW
(Not to Scale)
VOUT 1
VOUT 2
SENSE/ADJ 3
GND 4
VIN
8
VIN
7
SS
6
EN
5
NOTES
1. THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE
ENHANCES THERMAL PERFORMANCE AND IS
ELECTRICALLY CONNECTED TO GND INSIDE THE
PACKAGE. IT IS RECOMMENDED THAT THE EXPOSED
PAD CONNECT TO THE GROUND PLANE ON THE BOARD.
Figure 5. 8-Lead SOIC Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
6-Lead
LFCSP
8-Lead
SOIC
5-Lead
TSOT
Mnemonic
Description
1
1, 2
5
VOUT
Regulated Output Voltage. Bypass VOUT to GND with a 2.2 μF or greater capacitor.
2
3
4
SENSE/ADJ
Sense Input (SENSE). Connect to load. An external resistor divider may also be used to
set the output voltage higher than the fixed output voltage (ADJ).
3
4
2
GND
Ground.
4
5
3
EN
The enable pin controls the operation of the LDO. Drive EN high to turn on the
regulator. Drive EN low to turn off the regulator. For automatic startup, connect
EN to VIN.
5
6
Not
applicable
SS
Soft Start. An external capacitor connected to this pin determines the soft-start
time. Leave this pin open for a typical 380 μs start-up time. Do not ground this pin.
6
7, 8
1
VIN
Regulator Input Supply. Bypass VIN to GND with a 2.2 μF or greater capacitor.
EP
Exposed Pad. The exposed pad on the bottom of the package enhances thermal
performance and is electrically connected to GND inside the package. It is
recommended that the exposed pad connect to the ground plane on the board.



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