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DS20006080B-page 5

MIC5376/7/8

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Temperature Range

–40

—

+125

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 5 sec.

Storage Temperature

–65

—

+150

°C

—

Package Thermal Resistances

Thermal Resistance, 1x1 UDFN 4-Ld

—

250

—

°C/W —

Thermal Resistance, 1.2x1.2 TQFN

8-Ld

—

250

—

°C/W —

Thermal Resistance, SC-70-5

—

256.5

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.