MAX15053_V01 datasheet(19/21 Pages) MAXIM

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Power Dissipation

The MAX15053 is available in a 9-bump WLP package

and can dissipate up to 1127mW at TA = +70NC. When

the die temperature exceeds +150NC, the thermal-shut-

down protection is activated (see the Thermal-Shutdown

Protection

section).

Layout Procedure

Careful PCB layout is critical to achieve clean and stable

operation. It is highly recommended to duplicate the

MAX15053 Evaluation Kit layout for optimum perfor-

mance. If deviation is necessary, follow these guidelines

for good PCB layout:

1) Connect the signal and ground planes at a single point

immediately adjacent to the GND bump of the IC.

2) Place capacitors on IN and SS/REFIN as close as

possible to the IC and the corresponding pad using

direct traces.

3) Keep the high-current paths as short and wide as

possible. Keep the path of switching current short

and minimize the loop area formed by LX, the output

capacitors, and the input capacitors.

4) Connect IN, LX, and GND separately to a large copper

area to help cool the IC to further improve efficiency.

5) Ensure all feedback connections are short and direct.

Place the feedback resistors and compensation com-

ponents as close as possible to the IC.

6) Route high-speed switching nodes (such as LX) away

from sensitive analog areas(suchasFBandCOMP).

Figure 5. Application Circuit for PWM Mode Operation

GND

COMP

COUT

22µF

OUTPUT

1.8V AT 2A

4.02kI

8.06kI

2.32kI

3.3nF

LOUT

1µH

CFF

100pF

1.2I

1nF

RPULL

20kI

CIN

22µF

PGOOD

ENABLE

SKIP

OFF

CSS

22nF

SS/REFIN

MAX15053

INPUT

2.7V TO 5.5V

MAX15053

High-Efficiency, 2A, Current-Mode Synchronous,

Step-Down Switching Regulator

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