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AD8422ACPZ-R7 データシート(PDF) 26 Page - Analog Devices

部品番号 AD8422ACPZ-R7
部品情報  High Performance, Low Power, Rail-to-Rail Precision Instrumentation Amplifier
PDF  27 Pages
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

AD8422ACPZ-R7 データシート(HTML) 26 Page - Analog Devices

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AD8422
Data Sheet
Rev. B | Page 26 of 27
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
8
5
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
Figure 66. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
COMPLIANT TO JEDEC STANDARDS MO-187-AA
6°
0°
0.80
0.55
0.40
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
3.20
3.00
2.80
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
Figure 67. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
2.54
2.44
2.34
0.45
0.40
0.35
TOP VIEW
8
1
5
4
0.35
0.30
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
0.80
0.75
0.70
1.70
1.60
1.50
0.203 REF
0.20 MIN
0.05 MAX
0.02 NOM
0.65 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
SEATING
PLANE
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET
SIDE VIEW
P IN 1
IN D IC AT O R AR E A OP T IO N S
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
Figure 68. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-8-19)
Dimensions shown in millimeters



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