MCP7940N-ESLASHMS datasheet(49/58 Pages) MICROCHIP

部品番号	MCP7940N-E/MS

部品情報	Battery-Backed I2C Real-Time Clock/Calendar with SRAM

PDF	58 Pages

Scroll/Zoom	100%

メーカー	MICROCHIP [Microchip Technology]

ホームページ	http://www.microchip.com

Logo

49 / 58 page

 2011-2022 Microchip Technology Inc. and its subsidiares

DS20005010J-page 49

MCP7940N

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

1.50

1.60

MILLIMETERS

0.50 BSC

MIN

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

0.85

0.25

Microchip Technology Drawing No. C04-129-MN Rev. B

NOM

8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]

Contact Pad Spacing

2.90

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

SILK SCREEN

With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)

MCP7940N-E/MS データシート(PDF) 49 Page - Microchip Technology

MCP7940N-E/MS データシート(HTML) 49 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58

データシートダウンロード