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BLP27M810 データシート(PDF) 2 Page - Ampleon Netherlands B.V. |
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BLP27M810 データシート(HTML) 2 Page - Ampleon Netherlands B.V. |
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2 / 11 page ![]() BLP27M810 All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2016. All rights reserved. Product data sheet Rev. 1 — 11 February 2016 2 of 11 BLP27M810 Power LDMOS transistor 2. Pinning information [1] To be used in single ended applications only. [2] Connected to flange. 3. Ordering information 4. Limiting values 5. Thermal characteristics Table 2. Pinning Pin Description Simplified outline Graphic symbol [1] 1, 2, 7, 8, 9, 10, 15, 16 n.c. 3, 4, 5, 6 gate 11, 12, 13, 14 drain exposed die-pad source [2] 16 9 Transparent top view 18 5, 6 3, 4 exposed die-pad 11, 12 13, 14 aaa-017947 Table 3. Ordering information Type number Package Name Description Version BLP27M810 HVSON16 plastic thermal enhanced very thin small outline package; no leads;16 terminals; body 4 6 0.85 mm SOT1371-1 Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage - 65 V VGS gate-source voltage 0.5 +13 V Tstg storage temperature 65 +150 C Tj junction temperature - 225 C Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-c) thermal resistance from junction to case Tcase =80 C; PL =2W 3.2 K/W |
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