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10

Analog Technologies

Low Noise Constant Current Laser Controller

ATLS250MA103

MECHANICAL DIMENSIONS AND MOUNTING

The ATLS250MA103 comes in 2 packages: through hole

mount and surface mount. The former is often called DIP

(Dual Inline package) or D (short for DIP) package and has a

part number: ATLS250MA103D, and the latter is often called

SMT (Surface Mount Technology) or SMD (Surface Mount

Device) package and has a part number: ATLS250MA103S.

See below Figure 19 and 20.

Figure 19. Dimensions of the DIP Package Controller

Figure 20. Dimensions of the SMT Package Controller

Figure 21 shows the foot print which is seen from the top side

of the PCB, therefore, it is a “see through” view.

Figure 22 and Figure 23 show two recommended examples

for the bottom layer of the foot-print. It is highly

recommended to make the solder pads as large as possible in

order to dissipate more heat.

“Tent” (i.e. cover the entire via by the solder mask layer) all

the vias under the controller, otherwise, the vias can be

shorted by the bottom plate of the controller which is

internally connected the ground.

Please notice that, in the recommended foot print for the DIP

package, the holes for pin 2 to 6, and 8 to 12 have larger holes

than needed for the pins. This arrangement will make it easier

for removing the controller from the PCB, in case there is a

rework needed. The two smaller holes, for pin 1 and 7, will

hold the controller in the right position.

It is also recommended to use large copper fills for VPS,

PGND, and the LDC pins, and other pins if possible, to

decrease the thermal resistance between the module and the

supporting PCB, to lower the module temperature.

Please be notice that the SMT version cannot be soldered by

reflow oven. It must be soldered manually.

20.14

1.5

× 14

1.0

× 12

0.8

× 2

12

14.5

2

× 14

R1.0

× 4

PCB Copper

without solder pad

PCB Hole

Orientation Mark

Outline

Figure 21. Top Side PCB Foot-print for the DIP Package