25CSM04 datasheet(49/55 Pages) MICROCHIP

部品番号	25CSM04

部品情報	4-Mbit SPI Serial EEPROM with 128-Bit Serial Number and Enhanced Write Protection

PDF	55 Pages

Scroll/Zoom	100%

メーカー	MICROCHIP [Microchip Technology]

ホームページ	http://www.microchip.com

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49 / 55 page

 2019-2022 Microchip Technology Inc. and its subsidiares

DS20005817D-page 49

25CSM04

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

Overall Height

Bump Diameter

Bump Pitch

Width

Length

Bump Pitch

0.315

0.185

MIN

Dimension Limits

Units

MILLIMETERS

See Note 3

1.40 BSC

See Note 3

NOM

1.00 BSC

MAX

0.275

0.355

0.175

0.200

Bump Height

0.100

0.085

0.115

Body Height

0.190

0.175

0.205

Backside Laminate Thickness

0.025

0.015

0.035

Bump Pitch

2.10 BSC

0.50 BSC

8-Ball Wafer Level Chip Scale Package (CS) - [WLCSP]

Microchip Technology Drawing C04-21241 Rev B

3. Please contact your local Microchip representative for details.

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