MCP6V51-ESLASHMS datasheet(33/50 Pages) MICROCHIP

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2018-2022 Microchip Technology Inc. and its subsidiaries

DS20006136B-page 33

MCP6V51/2/4

Microchip Technology Drawing C04-091-OT Rev F Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

VIEW A-A

SHEET 1

5-Lead Plastic Small Outline Transistor (OT) [SOT23]

protrusions shall not exceed 0.25mm per side.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Foot Angle

Number of Pins

Pitch

Outside lead pitch

Overall Height

Molded Package Thickness

Standoff

Overall Width

Molded Package Width

Overall Length

Foot Length

Footprint

Lead Thickness

Lead Width

Notes:

Dimension Limits

Units

0°

0.08

0.20

10°

0.26

0.51

MILLIMETERS

0.95 BSC

1.90 BSC

0.30

0.90

0.89

0.60 REF

2.90 BSC

2.80 BSC

1.60 BSC

MIN

NOM

1.45

1.30

0.15

0.60

MAX

REF: Reference Dimension, usually without tolerance, for information purposes only.

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

Dimensioning and tolerancing per ASME Y14.5M

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