WSLF

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Vishay Dale

Revision: 28-Jun-2022

2

Document Number: 30193

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Notes

DIMENSIONS in inches (millimeters)

CONSTRUCTION OUTLINE

Notes

Note

in the resistance element. It is recommended to follow common design practices for power semiconductors that ensure the junction

temperature is maintained with in thermal limits by using large pad surfaces, thermal vias, heavier copper weights, internal layers as well as

other thermal spreading features. The thermal resistance values provided function in the same manner as junction to terminal temperature

TECHNICAL SPECIFICATIONS

PARAMETER

UNIT

WSLF RESISTOR CHARACTERISTICS

Component temperature coefficient

TCR measured from -55 °C to 150 °C

ppm/°C

± 200 for 0.3 m

Ω and 0.5 mΩ

± 170 for 1.0 m

Ω, 1.3 mΩ, and 1.5 mΩ

± 70 for 2 m

Ω, 3 mΩ, and 4 mΩ

ppm/°C

< 20

Operating temperature range

°C

-65 to +170

H

L

T

W

I

a

b

Typical current sensing traces

1

Resistive element: element material used is

dependent on resistance value. Refer to

Element Material in table)

2

Terminal: solid copper

3

Terminal / element weld

2

3

1

MODEL

DIMENSIONS

SOLDER PAD DIMENSIONS

LW

H

T

a

b

l

WSLF2512

0.250 ± 0.006

(6.35 ± 0.15)

0.120 ± 0.008

(3.02 ± 0.2)

0.0138 ± 0.0012

(0.35 ± 0.03)

0.045 - 0.016

(1.14 - 0.4)

0.071

(1.80)

0.13

(3.40)

0.13

(3.40)

GLOBAL

MODEL

RESISTANCE

VALUE

(mΩ)

THERMAL

RESISTANCE

(°C/W)

THICKNESS in inches (millimeters)

ELEMENT MATERIAL

WSLF2512

0.3

3.8

0.040 (1.02)

0.040 (1.02)

Mn-Cu-Sn

0.5

6.7

0.033 (0.84)

0.033 (0.84)

Mn-Cu

1.0

12.1

0.017 (0.43)

0.017 (0.43)

Mn-Cu

1.3

14.6

0.013 (0.33)

0.013 (0.33)

Mn-Cu

1.5

14.5

0.011 (0.28)

0.011 (0.28)

Mn-Cu

2.0

17.1

0.028 (0.71)

0.028 (0.71)

Ni-Cr

3.0

18.2

0.019 (0.48)

0.019 (0.48)

Ni-Cr

4.0

18.5

0.014 (0.36)

0.014 (0.36)

Ni-Cr