LMK6P datasheet(21/45 Pages) TI

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12.1.2 Best Practices for Signal Integrity

For the best electrical performance and signal integrity of entire system with the LMK6x, TI recommends routing

vias into decoupling capacitors and then to the LMK6x. TI also recommends increasing the via count and width

of the traces wherever possible. These steps ensure the lowest impedance and shortest path for high-frequency

current flow. Figure 12-1 shows the layout recommendation for the LMK6x.

Figure 12-1. LMK6x Layout Recommendation for Power Supply and Ground

12.1.3 Recommended Solder Reflow Profile

TI recommends following the solder paste supplier's recommendations to optimize flux activity and to achieve

proper melting temperatures of the alloy within the guidelines of J-STD-20. It is preferable for the LMK6x to

be processed with the lowest peak temperature possible while also remaining below the components peak

temperature rating as listed on the MSL label. The exact temperature profile would depend on several factors

including maximum peak temperature for the component as rated on the MSL label, Board thickness, PCB

material type, PCB geometries, component locations, sizes, densities within PCB, as well solder manufactures

recommended profile, and capability of the reflow equipment to as confirmed by the SMT assembly operation.

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LMK6C

SNAS826A – APRIL 2022 – REVISED JULY 2022

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LMK6P データシート(PDF) 21 Page - Texas Instruments