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MF-FSHT データシート(PDF) 3 Page - Bourns Electronic Solutions

部品番号 MF-FSHT
部品情報  MF-FSHT Series – PTC Resettable Fuses
PDF  6 Pages
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メーカー  BOURNS [Bourns Electronic Solutions]
ホームページ  http://www.bourns.com
Logo BOURNS - Bourns Electronic Solutions

MF-FSHT データシート(HTML) 3 Page - Bourns Electronic Solutions

  MF-FSHT Datasheet HTML 1Page - Bourns Electronic Solutions MF-FSHT Datasheet HTML 2Page - Bourns Electronic Solutions MF-FSHT Datasheet HTML 3Page - Bourns Electronic Solutions MF-FSHT Datasheet HTML 4Page - Bourns Electronic Solutions MF-FSHT Datasheet HTML 5Page - Bourns Electronic Solutions MF-FSHT Datasheet HTML 6Page - Bourns Electronic Solutions  
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MF-FSHT Series – PTC Resettable Fuses
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
How to Order
MF - FSHT 005 K X - 2
Multifuse® Product Designator
Series
FSHT = 0603 High Temperature Surface Mount Component
Hold Current, Ihold
005 - 016 (0.05 - 0.16 Amps)
K = Material Specific Code
X = Multifuse® freeXpansion™ Design
Packaging
-2 = Tape and Reel Packaged per EIA-481
Typical Part Marking
No marking
Packaging Quantity
5,000 pieces per reel
Solder Reflow Recommendations
TP
TP
tp
t s
TTO
RAMP-UP
L
TL
t L
25
Ts max
Ts min
PREHEAT
Time
CRITICAL ZONE
RAMP-DOWN
t 25 °C TO PEAK
Notes:
•
MF-FSHT models cannot be wave soldered or
hand soldered. Please contact Bourns for soldering
recommendations.
•
All temperatures refer to the topside of the device, measured
on the device body surface.
•
If reflow temperatures exceed the recommended profile,
devices may not meet the published specifications.
•
Compatible with Pb and Pb-free solder reflow profiles.
•
Excess solder may cause a short circuit.
•
Please refer to the Multifuse® Polymer PTC Resettable Fuse
Soldering Recommendations document for more details.
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)
3 °C / second max.
PREHEAT:
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time (Tsmin to Tsmax) (ts)
150 °C
200 °C
60~180 seconds
TIME MAINTAINED ABOVE:
Temperature (TL)
Time (tL)
217 °C
60~150 seconds
Peak Temperature (Tp)
260 °C
Time within 5 °C of Actual Peak Temperature (tp)
20~40 seconds
Ramp-Down Rate
6 °C / second max.
Time 25 °C to Peak Temperature
8 minutes max.



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