List of figures

Figure 1.

Pin connections ................................................................... 2

Figure 2.

TDM interface characteristics .......................................................... 6

Figure 3.

I²C slave timing diagram ............................................................. 8

Figure 4.

TDM block diagram ................................................................. 9

Figure 5.

WCLK, SDOUT change on the falling edge of BCLK and are valid on the rising edge of BCLK, no delay ..... 12

Figure 6.

WCLK, SDOUT change on the rising edge of BCLK and are valid on the falling edge of BCLK, no delay ..... 12

Figure 7.

WCLK, SDOUT change on the falling edge of BCLK and are valid on the rising edge of BCLK, delayed...... 13

Figure 8.

WCLK, SDOUT change on the rising edge of BCLK and are valid on the falling edge of BCLK, delayed...... 13

Figure 9.

Power-on sequence (TDM interface) .................................................... 16

Figure 10.

Disabled mode sequence ........................................................... 17

Figure 11.

LGA-14 2.5 x 2.5 x 0.86 mm package outline and mechanical data ............................... 23

Figure 12.

Carrier tape information for LGA-14 package .............................................. 24

Figure 13.

LGA-14 package orientation in carrier tape................................................ 24

Figure 14.

Reel information for carrier tape of LGA-14 package ......................................... 25

AIS25BA

List of figures

DS14019 - Rev 1

page 30/31