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D301 データシート(PDF) 395 Page - Microchip Technology |
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D301 データシート(HTML) 395 Page - Microchip Technology |
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395 / 416 page ![]() 2016-2018 Microchip Technology Inc. DS30010118D-page 395 PIC24FJ256GA705 FAMILY Microchip Technology Drawing C04-076C Sheet 2 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: L (L1) c θ SECTION A-A H Number of Leads Overall Height Lead Width Overall Width Overall Length Lead Length Molded Package Width Molded Package Length Molded Package Thickness Lead Pitch Standoff Units Dimension Limits A1 A b D E1 D1 A2 e L E N 0.80 BSC 0.45 0.30 - 0.05 0.37 12.00 BSC 0.60 10.00 BSC 10.00 BSC - - 12.00 BSC MILLIMETERS MIN NOM 44 0.75 0.45 1.20 0.15 MAX 0.95 1.00 1.05 REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Exact shape of each corner is optional. Dimensioning and tolerancing per ASME Y14.5M Footprint L1 1.00 REF θ 3.5° 0° 7° Foot Angle Lead Thickness c 0.09 - 0.20 44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [TQFP] |
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