D301 datasheet(399/416 Pages) MICROCHIP

部品番号	D301

部品情報	16-Bit General Purpose Microcontrollers with 256-Kbyte Flash and 16-Kbyte RAM in Low Pin Count Packages

PDF	416 Pages

Scroll/Zoom	100%

メーカー	MICROCHIP [Microchip Technology]

ホームページ	http://www.microchip.com

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399 / 416 page

 2016-2018 Microchip Technology Inc.

DS30010118D-page 399

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Dimension Limits

Units

Center Pad Width

Contact Pad Spacing

Center Pad Length

Contact Pitch

4.70

MILLIMETERS

0.40 BSC

MIN

MAX

6.00

Contact Pad Length (X48)

Contact Pad Width (X48)

0.80

0.20

Microchip Technology Drawing C04-2442A-M4

NOM

48-Lead Ultra Thin Plastic Quad Flat, No Lead Package (M4) - 6x6 mm Body [UQFN]

Contact Pad Spacing

6.00

Contact Pad to Center Pad (X48)

0.25

Thermal Via Diameter

Thermal Via Pitch

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

With Corner Anchors and 4.6x4.6 mm Exposed Pad

Pad Corner Radius (X 20)

0.10

Contact Pad to Contact Pad

0.20

Corner Anchor Pad Length (X4)

Corner Anchor Pad Width (X4)

0.90

ØV

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