D301 datasheet(401/416 Pages) MICROCHIP

401 / 416 page

 2016-2018 Microchip Technology Inc.

DS30010118D-page 401

PIC24FJ256GA705 FAMILY

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]

(L1)

SECTION A-A

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

protrusions shall not exceed 0.25mm per side.

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes:

Foot Length

Lead Width

Lead Thickness

Molded Package Length

Molded Package Width

Overall Length

Overall Width

Foot Angle

Footprint

Standoff

Overall Height

Lead Pitch

Number of Leads

12°

11°

13°

0.75

0.60

0.45

12°

0.22

7.00 BSC

9.00 BSC

3.5°

1.00 REF

0.09

0.17

11°

0°

13°

0.27

0.16

7°

1.00

0.50 BSC

NOM

MILLIMETERS

0.05

0.95

Units

MIN

1.05

0.15

1.20

MAX

Chamfers at corners are optional; size may vary.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or

plastic body at datum plane H

Datums A-B and D to be determined at center line between leads where leads exit

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