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LM35AH データシート(PDF) 6 Page - National Semiconductor (TI) |
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LM35AH データシート(HTML) 6 Page - National Semiconductor (TI) |
6 / 13 page Typical Performance Characteristics (Continued) Applications The LM35 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface and its temperature will be within about 0.01˚C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM35 die would be at an interme- diate temperature between the surface temperature and the air temperature. This is expecially true for the TO-92 plastic package, where the copper leads are the principal thermal path to carry heat into the device, so its temperature might be closer to the air temperature than to the surface tempera- ture. To minimize this problem, be sure that the wiring to the LM35, as it leaves the device, is held at the same tempera- ture as the surface of interest. The easiest way to do this is to cover up these wires with a bead of epoxy which will insure that the leads and wires are all at the same tempera- ture as the surface, and that the LM35 die’s temperature will not be affected by the air temperature. The TO-46 metal package can also be soldered to a metal surface or pipe without damage. Of course, in that case the V− terminal of the circuit will be grounded to that metal. Alternatively, the LM35 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM35 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where conden- sation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to insure that moisture cannot corrode the LM35 or its connec- tions. These devices are sometimes soldered to a small light-weight heat fin, to decrease the thermal time constant and speed up the response in slowly-moving air. On the other hand, a small thermal mass may be added to the sensor, to give the steadiest reading despite small deviations in the air temperature. Temperature Rise of LM35 Due To Self-heating (Thermal Resistance, θ JA) TO-46, TO-46*, TO-92, TO-92**, SO-8 SO-8** TO-220 no heat sink small heat fin no heat sink small heat fin no heat sink small heat fin no heat sink Still air 400˚C/W 100˚C/W 180˚C/W 140˚C/W 220˚C/W 110˚C/W 90˚C/W Moving air 100˚C/W 40˚C/W 90˚C/W 70˚C/W 105˚C/W 90˚C/W 26˚C/W Still oil 100˚C/W 40˚C/W 90˚C/W 70˚C/W Stirred oil 50˚C/W 30˚C/W 45˚C/W 40˚C/W (Clamped to metal, Infinite heat sink) (24˚C/W) (55˚C/W) *Wakefield type 201, or 1" disc of 0.020" sheet brass, soldered to case, or similar. **TO-92 and SO-8 packages glued and leads soldered to 1" square of 1/16" printed circuit board with 2 oz. foil or similar. Noise Voltage DS005516-34 Start-Up Response DS005516-35 www.national.com 6 |
同様の部品番号 - LM35AH |
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同様の説明 - LM35AH |
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