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A2P75S12M3-F データシート(PDF) 1 Page - STMicroelectronics |
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A2P75S12M3-F データシート(HTML) 1 Page - STMicroelectronics |
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1 / 14 page ![]() ACEPACK™ 2 Features • ACEPACK™ 2 power module – DBC Cu Al2O3 Cu • Sixpack topology – 1200 V, 75 A IGBTs and diodes – Soft and fast recovery diode • Integrated NTC Applications • Inverters • Industrial • Motor drives Description This power module is a sixpack topology in an ACEPACK™ 2 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz. Product status A2P75S12M3-F Product summary Order code A2P75S12M3-F Marking A2P75S12M3-F Package ACEPACK™ 2 Leads type Press fit contact pins ACEPACK™ 2 sixpack topology, 1200 V, 75 A trench gate field-stop IGBT M series, soft diode and NTC A2P75S12M3-F Datasheet DS11656 - Rev 5 - January 2019 For further information contact your local STMicroelectronics sales office. www.st.com |
同様の部品番号 - A2P75S12M3-F |
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同様の説明 - A2P75S12M3-F |
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