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L99MOD50XP データシート(PDF) 36 Page - STMicroelectronics |
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L99MOD50XP データシート(HTML) 36 Page - STMicroelectronics |
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36 / 42 page  Package and PCB thermal data L99MOD50XP 36/42 DS12615 Rev 4 6 Package and PCB thermal data 6.1 PowerSSO-36 thermal data Figure 11. PowerSSO-36 2 layer PCB Figure 12. PowerSSO-36 4 layer PCB Note: Layout condition of Rth and Zth measurements (board finish thickness 1.6 mm ±10%, board double layer and four layers, board dimension 129 mm x 60 mm, board material FR4, Cu thickness 0.070 mm (outer layers), Cu thickness 0.035 mm (inner layers), thermal vias separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm, footprint dimension 4.1 mm x 6.5 mm). 4-layer PCB: Cu on mid1 and mid2 layer: 76.45 cm2. Cu on bottom layer: 68.8 cm2. Zth measured on the major power dissipator contributor. |
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