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DRAM データシート(PDF) 2 Page - Kingston Technology Far East Co. Ltd

部品番号 DRAM
部品情報  Kingston DDR3/3L DRAM for embedded applications
PDF  2 Pages
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メーカー  KINGSTON [Kingston Technology Far East Co. Ltd]
ホームページ  https://www.kingston.com/
Logo KINGSTON - Kingston Technology Far East Co. Ltd

DRAM データシート(HTML) 2 Page - Kingston Technology Far East Co. Ltd

  DRAM Datasheet HTML 1Page - Kingston Technology Far East Co. Ltd DRAM Datasheet HTML 2Page - Kingston Technology Far East Co. Ltd  
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DRAM
DDR3/3L PART NUMBERS AND SPECIFICATIONS
Part Number
Capacity
Description
Package
Con guration
(Words x Bits)
Speed
Mbps
VDD,
VDDQ
Operating
Temperature
D1216ECMDXGJD
2Gb
96 ball FBGA
DDR3/3L C-Temp
7.5x13.5x1.2
128Mx16
1866 Mbps
1.35V*
0°C ~ +95°C
D2568ECMDPGJD
2Gb
78 ball FBGA
DDR3/3L C-Temp
7.5x10.6x1.2
256Mx8
1866 Mbps
1.35V*
0°C ~ +95°C
D2516ECMDXGJD
4Gb
96 ball FBGA
DDR3/3L C-Temp
7.5x13.5x1.2
256Mx16
1866 Mbps
1.35V*
0°C ~ +95°C
D5128ECMDPGJD
4Gb
78 ball FBGA
DDR3/3L C-Temp
7.5x10.6x1.2
512Mx8
1866 Mbps
1.35V*
0°C ~ +95°C
D2516ECMDXGME
4Gb
96 ball FBGA
DDR3/3L C-Temp
7.5x13.5x1.2
256Mx16
2133 Mbps
1.35V*
0°C ~ +95°C
B5116ECMDXGJD
8Gb
96 ball FBGA
DDR3/3L C-Temp
9x13.5x1.2
512Mx16
1866 Mbps
1.35V*
0°C ~ +95°C
*Backward compatible to 1.5V VDD, VDDQ
THIS DOCUMENT SUBJECT TO CHANGE WITHOUT NOTICE.
©2022 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved.
All trademarks and registered trademarks are the property of their respective owners.
US
MKF-944.1
MARKET SEGMENTS
KEY FEATURES
• Double Data Rate (DDR) architecture: two data transfers per clock cycle
• High-speed data transfer is realized by 8 bits prefetch pipelined architecture
• Bi-directional differential data strobe (DOS and /DQS) is transmitted/received
with data for capturing data at the receiver
• DOS is edge-aligned with data for READS; center-aligned with data for WRITES
• Differential clock inputs (CK and /CK)
• DLL aligns DQ and DOS transitions with CK transitions
• Commands entered on each positive CK edge; data and data mask referenced
to both edges of DQS
• Data Mask (DM) for write data
• Posted /CAS by programmable additive latency for better command and data
bus efficiency
• On-Die Termination (ODD for better signal quality)
o Synchronous ODT
o Dynamic CDT
o Asynchronous ODT
• Multi-Purpose Register (MPR) for pre-defined pattern read out
• ZQ calibration for DO drive and ODT
• Programmable Partial Array Self-Refresh (PASR)
• RESET pin for power-up sequence and reset function
• SRT range: normal/extended
• Programmable output driver impedance control
Industrial IoT / Robotics & Factory Automation
5G Networking/Telecommunications Communication
Modules (WiFi Routers and Mesh Devices)
Wearables (Smart Watches, Health Monitors, AR & VR)
Smart Home (Sound Bars, Thermostats, Fitness
Equipment, Vacuums, Beds, Faucets)
Smart City (HVAC, Lighting, Power Monitoring/
Metering, Parking Meters)



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