APM4220KA datasheet(2/11 Pages) ANPEC

2 / 11 page

Rev. B.1 - Apr., 2005

APM4220KA

www.anpec.com.tw

Symbol

Parameter

Rating

Unit

Common Ratings

(TA=25°C Unless Otherwise Noted)

VDSS

Drain-Source Voltage

VGSS

Gate-Source Voltage

±20

Maximum Junction Temperature

150

°C

TSTG

Storage Temperature Range

-55 to 150

°C

Mounted on Large Heat Sink

TC=25

°C

Maximum Power Dissipation

TC=100

°C

RθJC

Thermal Resistance-Junction to Case

2.5

°C/W

Mounted on PCB of 1in

2 Pad Areaj

TA=25°C

IDP

300

ìs Pulse Drain Current Tested

TA=100°C

TA=25°C

Continuous Drain Current

TA=100°C

TA=25°C

Maximum Power Dissipation

TA=100°C

1.2

RθJA

Thermal Resistance-Junction to Ambient

°C/W

Mounted on PCB of Minimum Footprint

TA=25°C

IDP

300

ìs Pulse Drain Current Tested

TA=100°C

TA=25°C

Continuous Drain Current

TA=100°C

TA=25°C

2.5

Maximum Power Dissipation

TA=100°C

RθJA

Thermal Resistance-Junction to Minimum Footprint

°C/W

Absolute Maximum Ratings

j.The value of R

θJA is when the device mounted on

1in2 pad with 2oz. Copper, t

≤ 10s.

Notes:

k. The value of R

θJA is when the device mounted on

minimum pad with 2oz. Copper, t

≤ 10s.

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