24AA00/24LC00/24C00

DS20001178J-page 24

 1996-2018 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

Y2

X2

1.50

1.60

MILLIMETERS

0.50 BSC

MIN

E

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

Y1

X1

0.85

0.25

Microchip Technology Drawing No. C04-129-MN Rev. B

NOM

8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]

12

8

C

Contact Pad Spacing

2.90

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

C

E

X1

Y1

Y2

X2

EV

EV

ØV

SILK SCREEN

With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)