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STM32C011F6P3TR データシート(PDF) 87 Page - STMicroelectronics |
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STM32C011F6P3TR データシート(HTML) 87 Page - STMicroelectronics |
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87 / 94 page  DS13866 Rev 3 87/94 STM32C011x4/x6 Package information 90 Figure 34. TSSOP20 – Footprint example 1. Dimensions are expressed in millimeters. Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks that identify the parts throughout supply chain operations, are not indicated below. k 0° - 8° 0° - 8° aaa - - 0.100 - - 0.0039 1. Values in inches are converted from mm and rounded to four decimal digits. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per side. 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side. Table 67. TSSOP20 – Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. YA_FP_V1 7.10 4.40 0.25 0.25 6.25 1.35 0.40 0.65 1.35 1 20 11 10 |
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