ISL98607 datasheet(27/29 Pages) RENESAS

部品番号	ISL98607

部品情報	High Efficiency Power Supply for Small Size Displays

PDF	29 Pages

Scroll/Zoom	100%

メーカー	RENESAS [Renesas Technology Corp]

ホームページ	http://www.renesas.com

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27 / 29 page

ISL98607

7. Package Outline Drawings

FN8421 Rev.1.00

Page 27 of 29

Jun.3.19

Package Outline Drawings

W4x5.20E

20 Ball Wafer Level Chip Scale Package (WLCSP) (BSC)

Rev 1, 1/13

NOTES:

Dimensions and tolerance per ASME Y 14.5M - 1994.

Dimension is measured at the maximum bump diameter

parallel to primary datum Z .

Primary datum Z and seating plane are defined by the spherical

crowns of the bump.

Bump position designation per JESD 95-1, SPP-010.

There shall be a minimum clearance of 0.10mm between

the edge of the bump and the body edge.

BOTTOM VIEW

TOP VIEW

SIDE VIEW

RECOMMENDED LAND PATTERN

PIN 1

PACKAGE

0.400

0.05 Z

0.265±0.035

0.200±0.030

0.540±0.050

(4X)

1.200

0.400

1.600

20x 0.265±0.035

0.200

SEATING PLANE

1.82±0.030

(A1 CORNER)

2.15±0.030

0.310

0.275

0.240

0.290

0.10

OUTLINE

0.10

Z X Y

0.05

0.040 BSC

(BACK IDE COATING)

For the most recent package outline drawing, see W4x5.20E.

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