データシートサーチシステム
  Japanese  ▼
ALLDATASHEET.JP

X  

BAS21LL データシート(PDF) 3 Page - Nexperia B.V. All rights reserved

部品番号 BAS21LL
部品情報  High-voltage switching diode
PDF  12 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
メーカー  NEXPERIA [Nexperia B.V. All rights reserved]
ホームページ  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

BAS21LL データシート(HTML) 3 Page - Nexperia B.V. All rights reserved

  BAS21LL Datasheet HTML 1Page - Nexperia B.V. All rights reserved BAS21LL Datasheet HTML 2Page - Nexperia B.V. All rights reserved BAS21LL Datasheet HTML 3Page - Nexperia B.V. All rights reserved BAS21LL Datasheet HTML 4Page - Nexperia B.V. All rights reserved BAS21LL Datasheet HTML 5Page - Nexperia B.V. All rights reserved BAS21LL Datasheet HTML 6Page - Nexperia B.V. All rights reserved BAS21LL Datasheet HTML 7Page - Nexperia B.V. All rights reserved BAS21LL Datasheet HTML 8Page - Nexperia B.V. All rights reserved BAS21LL Datasheet HTML 9Page - Nexperia B.V. All rights reserved Next Button
Zoom Inzoom in Zoom Outzoom out
 3 / 12 page
background image
Nexperia
BAS21LL
High-voltage switching diode
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating Sytem (IEC 60134)
Symbol
Parameter
Conditions
Min
Max
Unit
VRRM
repetitive peak reverse
voltage
-
250
V
VR
reverse voltage
-
200
V
IF
forward current
Tj = 25 °C
[1]
-
330
mA
tp = 1 µs; Tj(init) = 25 °C; square wave
-
9
A
tp = 100 µs; Tj(init) = 25 °C; square wave
-
3
A
IFSM
non-repetitive peak
forward current
tp = 10 ms; Tj(init) = 25 °C; square wave
-
1.7
A
IFRM
repetitive peak forward
current
tp ≤ 1 ms; δ ≤ 0.25
-
900
mA
[1]
-
335
mW
Ptot
total power dissipation
Tamb ≤ 25 °C
[2]
-
610
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated mounting pad for cathode 1cm2.
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
-
-
375
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
In free air
[2]
-
-
205
K/W
Rth(j-sp)
thermal resistance
from junction to solder
point
[3]
-
-
45
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for cathode 1cm2.
[3] Soldering point of cathode tab.
BAS21LL
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Product data sheet
27 February 2018
3 / 12



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12


データシート ダウンロード

Go To PDF Page


リンク URL



ALLDATASHEETはお客様のビジネスに役立ちますか?  [ DONATE ] 

Alldatasheetは   |   広告   |   お問い合わせ   |   プライバシーポリシー   |   データシートへのリンク    |   リンク交換   |   メーカーリスト
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com