Features

Specifications

BCM Advanced Research

www.bcmcom.com

11 Chrysler, Irvine, CA 92618 USA

An industry leader in industrial motherboards &

embedded computing

BCMSales@bcmcom.com

(949) 470-1888

* All product specifications and images are subject to change without notice. Last update:

Ordering Info

ESM-APLM-N4200-A1R

Intel® Pentium® N4200 SoC Processor Type10

COMe Mini Module, Onboard 4GB DDR3L

ESM-APLM-N3350-A1R

Intel® Celeron® N3350 SoC Processor Type10

COMe Mini Module, Onboard 4GB DDR3L

EEV-EX15-B1R

Mini-ITX Carrier Board for COMe Type 10 A1

ACC-ESMAPLM-SK-1R

Heatsink for ESM-APLM without Fan H=26 mm

ACC-ESMAPLM-SK-2R

Heatsink for ESM-APLM without Fan H=26 mm with

pad for eMMC

ACC-ESMAPLM-SD-1R

Heatspreader for ESM-APLM without Fan H=13 mm

ACC-ESMAPLM-SD-2R

Heatspreader for ESM-APLM without Fan H=13 mm

with pad for eMMC

2021/07/21

Mechanical & Environment

Power

Requirement

Standard Input

ATX: 4.75V~20V, 5Vsb ±5%;

AT: 4.75V~20V

Power Type

ATX/AT

Operating Temp

Standard: 0°C to 60°C (32°F ~ 140°F)

Storage Temp

-40°C ~ 75°C (-40°F ~ 167°F)

Operating

Humidity

40°C @ 95% Relative Humidity, Non-condensing

Form Factor

COM Express Modules

Dimensions

84 x 55 mm (3.31” x 2.17”)

Certification Info

CE, FCC Class B

System

CPU

Intel® Pentium® N4200 2.50 GHz (Burst) | 1.1 GHz Clock Quad

Core L2 cache 2MB 6W TDP

Intel® Celeron® N3350 2.40 GHz (Burst) | 1.1 GHz Clock Dual

Core L2 cache 1MB 6W TDP

Please note: CPU coolers are not included. Please see Ordering

Info tab for more details.

System Chipset

Integrated in SoC

System Memory

Onboard 4GB DDR3L

Optional 8GB DDR3L

SSD

Optional eMMC 5.1 up to 128GB

Audio

Intel® HD Audio integrated in SoC

Ethernet

Intel® Ethernet Controller I211-AT

10/100/1000 GbE Connection

BIOS

AMI UEFI BIOS, 128Mbit SPI Flash ROMM

I/O Chip

IT8528

Expansion

1 PCIe x4 (Supports x1, x2, x4, optional 1 PCIe x4 while remov-

ing Ethernet) compliant to PCIe Gen2 5.0 GT/s

OS Support

Microsoft® Windows 10

Linux (Kernel 4.6 above)

Display

Chipset

Intel® Atom™ SoC Integrated

LVDS

Single channel 18/24-bit LVDS from eDP-to-LVDS IC CH7511B

LVDS: up to 1920 x 1080 @ 60 Hz

Digital Display

Interface

DDI0 supports DisplayPort/HDMI/DVI-D

DisplayPort 1.2 up to 4096×2160@60Hz

HDMI 1.4b: up to 3840 x 2160 @ 30 Hz

eDP

Optional eDP 1.3: up to 3840 x 2160 @ 60Hz

External I/O

USB

2 x USB 3. 1 (Gen1) and 8 x USB 2.0

SATA

2 x SATA III (6 Gb/s)

MIO

1 x SMBus, 1 x LPC

GPIO

1 x 8-bit GPIO

• COMExpress™3.0MiniType10modulewithIntel®

Celeron® N3350 / Pentium® N4200 SoC BGA Processor

• Onboard4GBDDR3Lmemory,optional8GB

• OptionaleMMCforstorage

• Intel®Gen9LowPowergraphics,upto4Kresolutionand

H.265 codec

• 1xPCIex4(Supportsx1,x2,x4,optional1xPCIex4when

Ethernet is removed) compliant to PCIe Gen2 5.0 GT/s

• 2xSATAIII6Gb/s,2xUSB3.1(Gen1)and8xUSB2.0

Intel® Celeron®/ Pentium® SoC Processor COM

Express Mini Size Type 10 Module

OEM Only Product

ESM-APLM