SF400 datasheet(1/2 Pages) CUID

部品番号	SF400

部品情報	THERMAL PAD

PDF	2 Pages

Scroll/Zoom	100%

メーカー	CUID [CUI Devices]

ホームページ	https://www.cuidevices.com/

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1 / 2 page

date 08/05/2022

page 1 of 2

SERIES: SF400 | DESCRIPTION: THERMAL PAD

cuidevices.com

FEATURES

• 2.5 W/m*K thermal conductivity

• naturally tacky

• silicone based

• electrical isolation

• sizes to match CUI peltier footprints

SPECIFICATIONS

parameter

test method/conditions/description

min

typ

max

units

material

silicone elastomer

color

grey

thickness

ASTM D751

0.5

mm

specific gravity

ASTM D297

2.8

g/cc

hardness

ASTM D2240

25

80

shore OO

tensile strength

ASTM D412

25

psi

continuous use temperature

-58

200

°C

dielectric breakdown voltage

ASTM D149

2500

V

dielectric constant (1 MHz)

ASTM D150

6.0

volume resistivity

ASTM D257

1013

Ω*cm

thermal conductivity

ASTM D5470

2.5

W/m*K

RoHS

yes

PART NUMBER KEY

Base Number

Footprint Size (mm):

10x10 = 1010

15x15 = 1515

15x30 = 1530

20x20 = 2020

20x40 = 2040

26.25x50 = 2650

30x12 = 3012

30x30 = 3030

31.25x30 = 3130

40x40 = 4040

41.25x45 = 4145

50x50 = 5050

70x70 = 7070

SF400 - XXXX 05

Additional Resources: Product Page

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