BLP5LA55SG

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© Ampleon Netherlands B.V. 2023. All rights reserved.

Product data sheet

Rev. 1 — 7 April 2023

16 of 20

BLP5LA55SG

Power LDMOS transistor

Fig 19. Package outline TO-270-2G-1 (sheet 2 of 2)

DETAIL B

SCALE 50 : 1

B

TO-270-2G-1

Package outline drawing:

Revision:

Sheet 2 of 2

Revision date:

11/7/2022

Tolerances unless otherwise stated:

Dimension:

0.05

Angle:

1°

Third angle projection

TO-270-2G-1

0

units in mm.

Drawing Notes

Items

Description

(1)

Dimensions are excluding mold protrusion. The mold protrusion is maximum 0.15 mm per side. See also detail B.

In the dambar area max. protrusion is 0.55mm max. in lenght and 0.3 mm max. in width (4x) See also detail B.

(2)

The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location.

(3)

The leads and exposed heatsink are plated with matte Tin (Sn).

(4)

Dimensions (Heatsink ears) 10,67 and 1,78 do not include mouldprotrusion. Overall Max. dimensions incl. mould

protrusions is 10,92 mm. (max.) and 2,03 mm. (max.).

(5)

Surfaces may remain unplated (not solderable surfaces).

Lead Dambar protrusion (#2)

0.15 m

ax. (#1

)

(0.3 m

ax.)