ING-RRC datasheet(20/21 Pages) ETC1

20 / 21 page

INGT165B / INGR165B

10/2003 - rev. 2.0

20 of 21

4.5 PACKAGE HANDLING PRECAUTIONS

BGA packages are moisture-sensitive and are delivered in sealed dry packs.

The devices presented in this datasheet meet JEDEC standard 22A113B, Level 3.

Handling precautions are:

1. Shelf life in sealed dry pack : 12 months at < 40° C and < 90% RH

2. After the dry pack is opened, devices that will undergo infrared reflow, vapor-phase reflow, or

equivalent processing (peak package body temperature 220° C, maximum peak temperature package

exposure time 10 sec) must be:

a) mounted within 168 hrs at factory conditions of <=30° C / 60% RH, or

b) stored at <= 20% RH or

c) be baked less than 168 hrs before undergoing infrared reflow, vapor-phase reflow, or equivalent

processing (peak package body temperature 220° C)

3. If baking is required, devices may be baked for :

a) 192 hours at 40° C + 5° C / -0° C and < 5% RH

b) 24 hours at 125° C + 5° C / -5° C (for baking above 130° C, high-temperature trays are required)

4. Precautions have to be taken against exposure of the device terminals to electrostatic discharge stress

5. The maximum ratings may not be exceeded at any time

6. At power-up and power-down sequences, all supply voltage nodes have to be ramped up and down

with identical voltage ramping, otherwise the maximum rating of ID (I/O Current DC or transient per pin)

can be exceeded and damage to the device may occur.

ING-RRC データシート(PDF) 20 Page - List of Unclassifed Manufacturers