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ADV7393 データシート(PDF) 95 Page - Analog Devices |
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ADV7393 データシート(HTML) 95 Page - Analog Devices |
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95 / 96 page  ADV7390/ADV7391/ADV7392/ADV7393 Rev. 0 | Page 95 of 96 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2 0.30 0.23 0.18 0.20 REF 0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM 12° MAX 1.00 0.85 0.80 SEATING PLANE COPLANARITY 0.08 1 32 8 9 25 24 16 17 0.50 0.40 0.30 3.50 REF 0.50 BSC PIN 1 INDICATOR TOP VIEW 5.00 BSC SQ 4.75 BSC SQ 3.25 3.10 SQ 2.95 PIN 1 INDICATOR 0.60 MAX 0.60 MAX 0.25 MIN EXPOSED PAD (BOTTOM VIEW) EXPOSED PADDLE MUST BE SOLDERED TO PCB GROUND FOR PROPER HEAT DISSIPATION, NOISE IMMUNITY AND MECHANICAL STRENGTH BENEFITS. Figure 142. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 5 mm × 5 mm Body, Very Thin Quad (CP-32-2) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2 1 40 10 31 30 21 20 4.25 4.10 SQ 3.95 TOP VIEW 6.00 BSC SQ PIN 1 INDICATOR 5.75 BCS SQ 12° MAX 0.30 0.23 0.18 0.20 REF SEATING PLANE 1.00 0.85 0.80 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.80 MAX 0.65 TYP 4.50 REF 0.50 0.40 0.30 0.50 BSC PIN 1 INDICATOR 0.60 MAX 0.60 MAX 0.25 MIN EXPOSED PAD (BOT TOM VIEW) EXPOSED PADDLE MUST BE SOLDERED TO PCB GROUND FOR PROPER HEAT DISSIPATION, NOISE IMMUNITY AND MECHANICAL STRENGTH BENEFITS. Figure 143. 40-Lead Frame Chip Scale Package [LFCSP] (CP-40) Dimensions shown in millimeters |
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