LP5996 datasheet(6/14 Pages) NSC

6 / 14 page

Electrical Characteristics(Notes 2, 8) (Continued)

Unless otherwise noted, V

EN = 950mV, VIN =VOUT + 1.0V, or 2.0V, whichever is higher, where VOUT is the higher of VOUT1

and V

OUT2.CIN = 1 µF, IOUT = 1 mA, COUT1 =COUT2 = 1.0µF. Typical values and limits appearing in normal type apply for TA

= 25˚C. Limits appearing in boldface type apply over the full junction temperature range for operation, −40 to +125˚C.

Symbol

Parameter

Conditions

Typ

Limit

Units

Min

Max

PSRR

Power Supply Rejection Ratio

(Note 11)

f = 1kHz, I

OUT

= 1mA to

150mA

BYP = 10nF

LDO1

LDO2

f = 20kHz, I

OUT

= 1mA to

150mA

BYP = 10nF

LDO1

LDO2

Output noise Voltage (Note 11)

BW = 10Hz to

100kHz

BYP = 10nF

OUT = 0.8V

µV

RMS

OUT = 3.3V

SHUTDOWN

Thermal Shutdown

Temperature

160

˚C

Hysteresis

Enable Control Characteristics

Input Current at V

EN1 or VEN2

EN = 0.0V

0.005

0.1

µA

EN =6V

Low Input Threshold

0.4

High Input Threshold

0.95

Timing Characteristics

Turn On Time (Note 11)

To 95% Level

BYP = 10nF

300

µs

Transient

Response

Line Transient Response |

δV

OUT|

(Note 11)

rise =Tfall = 10µs

δV

IN = 1VCBYP = 10nF

(pk - pk)

Load Transient Response

δV

OUT|

(Note 11)

rise =Tfall =

1µs

LDO 1

OUT = 1mA to

150mA

175

LDO 2

OUT = 1mA to

300mA

150

Note 1: Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the device is

guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical

Characteristics tables.

Note 2: All Voltages are with respect to the potential at the GND pin.

Note 3: For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN-1187, Leadless Leadframe Package.

Note 4: Internal thermal shutdown circuitry protects the device from permanent damage.

Note 5: The human body model is 100pF discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF capacitor discharged directly into each

pin.

Note 6: The maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op) = 125˚C), the maximum power

dissipation of the device in the application (PD(max)), and the junction to ambient thermal resistance of the part/package in the application (θJA), as given by the

following equation: TA(max) =TJ(max-op) -(θJA xPD(max)).

Note 7: Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power dissipation is possible,

special care must be paid to thermal dissipation issues in board design.

Note 8: Min Max limits are guaranteed by design, test or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.

Note 9: VIN(MIN) =VOUT(NOM) + 0.5V, or 2.0V, whichever is higher.

Note 10: Dropout voltage is voltage difference between input and output at which the output voltage drops to 100mV below its nominal value. This parameter only

for output voltages above 2.0V

Note 11: This electrical specification is guaranteed by design.

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