3 / 4 page
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March 2000
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4.0
Package Information
Table 5: 8-pin SOIC (0.150") Package Dimensions
DIMENSIONS
INCHES
MILLIMETERS
MIN.
MAX.
MIN.
MAX.
A
0.061
0.068
1.55
1.73
A1
0.004
0.0098
0.102
0.249
A2
0.055
0.061
1.40
1.55
B
0.013
0.019
0.33
0.49
C
0.0075
0.0098
0.191
0.249
D
0.189
0.196
4.80
4.98
E
0.150
0.157
3.81
3.99
e
0.050 BSC
1.27 BSC
H
0.230
0.244
5.84
6.20
h
0.010
0.016
0.25
0.41
L
0.016
0.035
0.41
0.89
Θ
0
°
8
°
0
°
8
°
B
D
A
1
SEATING
PLANE
H
E
8
1
ALL RADII:
0.005" TO 0.01"
BASE
PLANE
A
2
e
ÅÉ"ÇÅÃÇ"#)#$É#ÃÇ
A
R
C
L
θ
7° typ.
h x 45°
Table 6: 8-pin SOIC (0.150") Package Characteristics
PARAMETER
SYMBOL
CONDITIONS/DESCRIPTION
TYP.
UNITS
Thermal Impedance, Junction to Free-Air
8-pin 0.150” SOIC
Θ
JA
Air flow = 0 m/s
110
°C/W
Corner lead
2.0
Lead Inductance, Self
L11
Center lead
1.6
nH
Lead Inductance, Mutual
L12
Any lead to any adjacent lead
0.4
nH
Lead Capacitance, Bulk
C11
Any lead to VSS
0.27
pF
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