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PCMFXUSB30_SER

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Product data sheet

Rev. 1 — 01 April 2016

19 of 23

Nexperia

PCMFxUSB30 series

Common-mode EMI filter for differential channels with ESD protection

Fig 28. Soldering footprint WLCSP10 (PCMF2USB30)

Fig 29. Soldering footprint WLCSP15 (PCMF3USB30)

WLCSP10: Solder footprint and stencil aperture

PCMF2USB30

pcmf2usb30_fr

solder resist opening (SR)

occupied area

solder land plus solder paste

solder paste deposit (SP)

solder land (SL)

Dimensions in mm

P1

SR

P

0.80 0.25

0.325

Hx

1.80

SL

0.25

SP

0.40

16-03-22

Hy

1.40

SL = SP

SR

detail X

see

detail X

P

P

P1

Hx

Hy

recommend stencil thickness: 0.1 mm

WLCSP15: Solder footprint and stencil aperture

PCMF3USB30

pcmf3usb30_fr

solder resist opening (SR)

occupied area

solder land plus solder paste

solder paste deposit (SP)

solder land (SL)

Dimensions in mm

P1

SR

P

0.80 0.25

0.325

Hx

2.60

SL

0.25

SP

0.40

16-03-22

recommend stencil thickness: 0.1 mm

Hy

1.40

SL = SP

SR

detail X

see

detail X

P

P

P1

Hx

Hy