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MP2172 データシート(PDF) 2 Page - Monolithic Power Systems

部品番号 MP2172
部品情報  5.5V, 2A, 2.6MHz,Synchronous, Step-Down Switcher
PDF  17 Pages
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メーカー  MPS [Monolithic Power Systems]
ホームページ  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP2172 データシート(HTML) 2 Page - Monolithic Power Systems

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MP2172 – 5.5V, 2A, 2.6MHz, SYNCHRONOUS STEP-DOWN SWITCHER
MP2172 Rev. 1.0
www.MonolithicPower.com
2
4/24/2019
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2019 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
MP2172GJ
TSOT23-8
See Below
* For Tape & Reel, add suffix –Z (e.g.: MP2172GJ–Z).
TOP MARKING
BCG: Product code of MP2172GJ
Y: Year code
PACKAGE REFERENCE
TOP VIEW
4
3
2
1
8
7
6
5
PG
VIN
SW
PGND
EN
FB
AGND
OUT
TSOT23-8
ABSOLUTE MAXIMUM RATINGS (1)
Supply voltage (VIN) ........................................ 6V
VSW .................................... -0.3V (-5V for <10ns)
to VIN + 0.3V (8V for <10ns)
All other pins .................................. -0.3V to +6 V
Junction temperature ................................ 150°C
Lead temperature...................................... 260°C
Continuous power dissipation (TA = 25°C) (2)
...................................................................1.25W
Storage temperature.................-65°C to +150°C
Recommended Operating Conditions (3)
Supply voltage (VIN) ........................ 2.5V to 5.5V
Output voltage (VOUT).............. 0.6V to VIN - 0.5V
Operating junction temp. (TJ)....-40°C to +125°C
Thermal Resistance (4)
θJA
θJC
TSOT23-8 ............................. 100 ..... 55 ...°C/W
NOTES:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation produces an excessive die temperature, causing
the device to go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.



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