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MP2172 データシート(PDF) 2 Page - Monolithic Power Systems |
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MP2172 データシート(HTML) 2 Page - Monolithic Power Systems |
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2 / 17 page ![]() MP2172 – 5.5V, 2A, 2.6MHz, SYNCHRONOUS STEP-DOWN SWITCHER MP2172 Rev. 1.0 www.MonolithicPower.com 2 4/24/2019 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2019 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking MP2172GJ TSOT23-8 See Below * For Tape & Reel, add suffix –Z (e.g.: MP2172GJ–Z). TOP MARKING BCG: Product code of MP2172GJ Y: Year code PACKAGE REFERENCE TOP VIEW 4 3 2 1 8 7 6 5 PG VIN SW PGND EN FB AGND OUT TSOT23-8 ABSOLUTE MAXIMUM RATINGS (1) Supply voltage (VIN) ........................................ 6V VSW .................................... -0.3V (-5V for <10ns) to VIN + 0.3V (8V for <10ns) All other pins .................................. -0.3V to +6 V Junction temperature ................................ 150°C Lead temperature...................................... 260°C Continuous power dissipation (TA = 25°C) (2) ...................................................................1.25W Storage temperature.................-65°C to +150°C Recommended Operating Conditions (3) Supply voltage (VIN) ........................ 2.5V to 5.5V Output voltage (VOUT).............. 0.6V to VIN - 0.5V Operating junction temp. (TJ)....-40°C to +125°C Thermal Resistance (4) θJA θJC TSOT23-8 ............................. 100 ..... 55 ...°C/W NOTES: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature, causing the device to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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