MP2117

– 1.25MHZ, 2.2A SYNCHRONROUS STEP-DOWN SWITCHER

END OF LIFE, REFER TO MP1605

MP2117 Rev. 0.92

www.MonolithicPower.com

10

6/20/2022

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Thermal Dissipation

Power dissipation should be considered when

MP2117 provide maximum 2.2A output current to

the loads at high ambient temperature. If the

junction temperature rises above 150

C, the

MP2117 will be shut down.

The junction-to-ambient thermal resistance of the

10-pin QFN or 8-pin SOIC RΘJA is 50C/W. The

maximum power dissipation is about 1.6W when

the MP2117 is operating in a 70

C ambient

temperature environment.

W

6

.

1

W

/

C

50

C

70

C

150

PD

o

o

o

MAX

=

−

=

PCB Layout

The high current paths (GND, IN, OUT and SW)

should be placed very close to the device with

short, direct and wide traces. Input capacitors

should be placed as close as possible to the

respective IN and PGND pins. The external

feedback resistors should be placed next to the

FB pins. Keep the switching nodes SW short and

away from the feedback network. An external

diode (i.e. B130) can be added between SW and

GND to reduce switching noise and to improve

the load regulation. The reference layout and its

schematic are shown below:

Top Layer

Bottom Layer

Figure 3