PESDXUSB30_SER

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©

Nexperia B.V. 2016. All rights reserved.

Product data sheet

Rev. 2 — 26 April 2016

15 of 19

Nexperia

PESDxUSB30 series

ESD protection for differential data lines

Fig 19. Soldering footprint WLCSP10 (PESD2USB30)

Fig 20. Soldering footprint WLCSP15 (PESD3USB30)

WLCSP10: Solder footprint and stencil aperture

PESD2USB30

pesd2usb30_fr

solder resist opening (SR)

occupied area

solder land plus solder paste

solder paste deposit (SP)

solder land (SL)

Dimensions in mm

P1

SR

P

0.80 0.25

0.325

Hx

1.80

SL

0.25

SP

0.40

16-01-19

Hy

1.40

SL = SP

SR

detail X

see

detail X

P

P

P1

Hx

Hy

recommend stencil thickness: 0.1 mm

WLCSP15: Solder footprint and stencil aperture

PESD3USB30

pesd3usb30_fr

solder resist opening (SR)

occupied area

solder land plus solder paste

solder paste deposit (SP)

solder land (SL)

Dimensions in mm

P1

SR

P

0.80 0.25

0.325

Hx

2.60

SL

0.25

SP

0.40

16-01-19

recommend stencil thickness: 0.1 mm

Hy

1.40

SL = SP

SR

detail X

see

detail X

P

P

P1

Hx

Hy