UPD703003A datasheet(39/45 Pages) RENESAS

39 / 45 page

µPD703003A, 703004A, 703025A, 703003A(A), 703025A(A)

Data Sheet U13188EJ6V1DS

5. RECOMMENDED SOLDERING CONDITIONS

The

µPD703003A, 703004A, 703025A, 703003A(A), and 703025A(A) should be soldered and mounted under the

following recommended conditions.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Table 5-1. Surface Mounting Type Soldering Conditions (1/2)

(1)

µPD703003AGC-33-×××-8EU:

100-pin plastic LQFP (fine pitch) (14

× 14)

µPD703004AGC-33-×××-8EU:

100-pin plastic LQFP (fine pitch) (14

× 14)

µPD703025AGC-33-×××-8EU:

100-pin plastic LQFP (fine pitch) (14

× 14)

µPD703003AGC(A)-33-×××-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)

µPD703025AGC(A)-33-×××-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

IR35-107-2

VPS

VP15-107-2

Partial heating

—

Note After opening the dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

Remark

For soldering methods and conditions other than those recommended above, consult an NEC Electronics

sales representative.

Package peak temperature: 235

°C, Time: 30 seconds max. (at 210°C or

higher), Count: Two times or less, Exposure limit: 7 daysNote (after that,

prebake at 125

°C for 10 to 72 hours)

Package peak temperature: 215

°C, Time: 25 to 40 seconds (at 200°C or

higher), Count: Two times or less, Exposure limit: 7 daysNote (after that,

prebake at 125

°C for 10 to 72 hours)

Pin temperature: 300

°C max., Time 3 seconds max. (per pin row)

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