Nexperia

PSMN2R8-80SSF

NextPower 80 V, 2.8 mOhm, 190 Amp, N-channel MOSFET in LFPAK88 package

12. Soldering

SOT1235

Footprint information for reflow soldering of LFPAK88 package

sot1235_fr

Issue date 18-12-12

18-12-13

occupied area

1.25

0.2

0.2

0.1

1.15

1.3

1.4

1.6

1.76

5.7

3.74

9.4

6.55

6.8

7

0.7

4.275

7.8

1.6

1.225

1.9

2.925

1.85

2.05

1.7

1.2

2.1

8.6

0.3

0.2

0.2

0.7

8.8

9.2

solder land

solder resist

solder paste

Dimensions in mm

1.2

1.4

7.8

recommended stencil thickness: 0.125 mm

1.1

2

Fig. 6. Reflow soldering footprint for LFPAK88 (SOT1235)

PSMN2R8-80SSF

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Objective data sheet

23 June 2022

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