BYV97 datasheet(3/9 Pages) PHILIPS

3 / 9 page

1996 Jun 07

Philips Semiconductors

Product speciﬁcation

Fast soft-recovery

controlled avalanche rectiﬁers

BYV97 series

ELECTRICAL CHARACTERISTICS

Tj =25 °C unless otherwise speciﬁed.

THERMAL CHARACTERISTICS

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer

≥40 µm, see Fig. 12.

For more information please refer to the

“General Part of associated Handbook”.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

forward voltage

IF = 3 A; Tj =Tj max; see Fig.8

1.35

IF = 3 A; see Fig.8

−−

1.65

V(BR)R

reverse avalanche

breakdown voltage

IR = 0.1 mA

BYV97F

1300

−−

BYV97G

1500

−−

reverse current

VR =VRRMmax;

see Fig.9

−−

µA

VR =VRRMmax; Tj = 165 °C;

see Fig.9

−−

150

µA

trr

reverse recovery time

when switched from IF = 0.5 A

to IR = 1 A; measured at

IR = 0.25 A; see Fig.14

−−

500

diode capacitance

f = 1 MHz; VR = 0 V; see Fig.11

−

maximum slope of

reverse recovery current

when switched from IF = 1 A to

VR ≥ 30 V and dIF/dt = −1A/µs;

see Figs 10 and 13

−−

5A/

µs

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

Rth j-tp

thermal resistance from junction to tie-point

lead length = 10 mm

K/W

Rth j-a

thermal resistance from junction to ambient

note 1

100

K/W

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