MCP3002 datasheet(19/34 Pages) MICROCHIP

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DS21294E-page 19

MCP3002

6.4

Layout Considerations

When laying out a printed circuit board for use with

analog components, care should be taken to reduce

noise wherever possible. A bypass capacitor should

always be used with this device and should be placed

as close as possible to the device pin. A bypass

capacitor value of 1 µF is recommended.

Digital and analog traces should be separated as much

as possible on the board and no traces should run

underneath the device or the bypass capacitor. Extra

precautions should be taken to keep traces with high-

frequency signals (such as clock lines) as far as

possible from analog traces.

Use of an analog ground plane is recommended in

order to keep the ground potential the same for all

devices on the board. Providing VDD connections to

devices in a “star” configuration can also reduce noise

by eliminating current return paths and associated

errors. See Figure 6-4. For more information on layout

tips when using A/D converters, refer to AN-688

“Layout Tips for 12-Bit A/D Converter Applications”

(DS00688).

FIGURE 6-4:

VDD traces arranged in a

‘Star’ configuration in order to reduce errors

caused by current return paths.

VDD

Connection

Device 1

Device 2

Device 3

Device 4

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