Philips Semiconductors

ISP1107

Advanced USB transceiver

Objective specification

Rev. 01 — 23 February 2000

13 of 19

9397 750 06899

© Philips Electronics N.V. 2000. All rights reserved.

Fig 12. TSSOP16 package outline.

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.40

0.06

8

0

o

o

0.13

0.1

0.2

1.0

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT403-1

MO-153

95-04-04

99-12-27

D

Z

e

0.25

18

16

9

θ

A

Q

detail X

L

(A )

3

E

c

X

A

y

0

2.5

5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

A

max.

1.10

pin 1 index