NLAST4599

http://onsemi.com

2

MAXIMUM RATINGS (Note 1)

Parameter

Symbol

Value

Unit

Positive DC Supply Voltage

−0.5 to +7.0

V

−0.5

V

Digital Select Input Voltage

−0.5

V

DC Current, Into or Out of Any Pin

$50

mA

Power Dissipation in Still Air

SC−88

TSOP6

200

200

mW

Storage Temperature Range

−65 to +150

°C

Lead Temperature, 1mm from Case for 10 seconds

260

°C

Junction Temperature Under Bias

150

°C

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

2000

200

N/A

V

Latchup Performance

$300

mA

Thermal Resistance

SC−88

TSOP6

333

333

°C/W

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the

Recommended Operating Conditions.

2. Tested to EIA/JESD22−A114−A

3. Tested to EIA/JESD22−A115−A

4. Tested to JESD22−C101−A

5. Tested to EIA/JESD78

RECOMMENDED OPERATING CONDITIONS

Characteristics

Symbol

Min

Max

Unit

DC Supply Voltage

2.0

5.5

V

Digital Select Input Voltage

GND

5.5

V

Analog Input Voltage (NC, NO, COM)

GND

V

Operating Temperature Range

−55

+125

°C

Input Rise or Fall Time

SELECT

0

0

100

20

ns/V

DEVICE JUNCTION TEMPERATURE VERSUS TIME

TO 0.1% BOND FAILURES

Junction

Temperature

5C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

1

10

100

1000

TIME, YEARS

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 3. Failure Rate vs. Time Junction Temperature