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STM805 データシート(PDF) 22 Page - STMicroelectronics |
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STM805 データシート(HTML) 22 Page - STMicroelectronics |
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22 / 32 page ![]() STM690/704/795/802/804/805/806 22/32 Figure 34. E to ECON Propagation Delay vs. Temperature MAXIMUM RATING Stressing the device above the rating listed in the Absolute Maximum Ratings” table may cause per- manent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not im- plied. Exposure to Absolute Maximum Rating con- ditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality docu- ments. Table 5. Absolute Maximum Ratings Note: 1. Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C for between 90 to 150 seconds). Temperature ( °C) AI09157b 0.0 1.0 2.0 3.0 4.0 –40 –20 0 20 40 60 80 100 120 VCC = 3.0V VCC = 4.5V VCC = 5.5V Symbol Parameter Value Unit TSTG Storage Temperature (VCC Off) –55 to 150 °C TSLD (1) Lead Solder Temperature for 10 seconds 260 °C VIO Input or Output Voltage –0.3 to VCC +0.3 V VCC/VBAT Supply Voltage –0.3 to 6.0 V IO Output Current 20 mA PD Power Dissipation 320 mW |
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