MPC8555CPXAPF datasheet(75/88 Pages) FREESCALE

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MPC8555CPXAPF データシート(PDF) 75 Page - Freescale Semiconductor, Inc

部品番号	MPC8555CPXAPF

部品情報	PowerQUICC??III Integrated Communications Processor Hardware Specifications

PDF	88 Pages

Scroll/Zoom	100%

メーカー	FREESCALE [Freescale Semiconductor, Inc]

ホームページ	http://www.freescale.com

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75 / 88 page

MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Thermal

The spring mounting should be designed to apply the force only directly above the die. By localizing the

force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to

the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the

opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the

package. Figure 47 and provide exploded views of the plastic fence, heat sink, and spring clip.

Figure 47. Exploded Views (1) of a Heat Sink Attachment using a Plastic Fence

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