MPX12

Sensors

Freescale Semiconductor

5

Figure 4. Unibody Package — Cross-Sectional Diagram (not to scale)

Figure 4 illustrates the differential or gauge configuration

in the basic chip carrier (Case 344). A silicone gel isolates the

die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the silicon

diaphragm.

The MPX12 series pressure sensor operating

characteristics and internal reliability and qualification tests

are based on use of dry air as the pressure media. Media

other than dry air may have adverse effects on sensor

performance and long term reliability. Contact the factory for

information regarding media compatibility in your application/

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing silicone gel which

isolates the die from the environment. The Freescale MPX

pressure sensor is designed to operate with positive

differential pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table

Silicone

Die Coat

Die

P1

P2

Wire Bond

Lead Frame

RTV Die

Bond

Epoxy

Case

Stainless Steel

Metal Cover

Part Number

Case Type

Pressure (P1) Side Identifier

MPX12D

344

Stainless Steel Cap

MPX12DP

344C

Side with Part Marking

MPX12GP

344B

Side with Port Attached